Document Number: 45158
For technical questions, contact: mlcc@vishay.com
www.vishay.com
Revision: 26-Aug-10
23
VJ 3505
VJ 3505 UHF Chip Antenna for Mobile Devices
Vishay Vitramon
VJ 3505 ASSEMBLY GUIDELINES
1. Mounting of antennas on a printed circuit board should be done by reflow soldering. The reflow soldering profiles are shown
below.
2. In order to provide the adequate strength between the antenna and the PCB the application of a dot of heat cured epoxy glue
in the center of the footprint of the antenna prior to the antennas soldering to the board should be done. An example for such
glue could be Heraeus PD 860002 SA. The weight of the dot should be 5 mg to 10 mg.
Fig. 6 - Soldering IR Reflow with SnPb Solder
Fig. 7 - Soldering Reflow with Sn Solder
Time
30 s to 60 s
30 s to 60 s
30 s to 60 s
0
50
100
150
200
250
300
T
C)
> 215 癈: 20 s to 40 s
Max. temperature
Min. temperature
Sn-Pb eutectic solder paste
0
50
100
150
200
250
300
T
癈)
260 癈
50
100
150
200
250
 245 癈
215 癈
180 癈
130 癈
40 s
10 s
10 s
2 K/s
?/DIV>
?/DIV>
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